Patent Pending CCS Technology™ improves polish performance by slowing and controlling the rate of polish absorbtion

Background of CCS Technology™

Conventional foam pads absorb polish too quickly. This reduces polish and pad performance because most of the polish is trapped below the working surface of the pad. CCS technology™ solves this common problem using stategic patterns of partially closed foam cells.

Benefits:

SLOW RATE OF POLISH ABSORBTION - Enhances polish performance.

IMPROVES OPERATOR CONTROL - CCS pockets gradually release polish as needed by the operator.

PREVENTS PAD SKIPPING - CCS pockets reduce surface tension allowing operator to run pad flat on working surface.

CREATES LESS HEAT - CCS pockets reduce surface contact resulting in less friction generated heat.

OEM APPROVED - OEM tests confirm CCS pads out-perform convoluted pad designs.